深圳市泽芯微科技有限公司

型号： 厂商： 批号： 封装：

型号	数量	厂商	批号	封装	更新时间	询价
STC15W408AS-35I-SOP28(15W408AS/35I-SOP28)	104	STC	1734＋	SOP28	20-10-09	询价
STM32F407IGT6(STM32F407IGT6)	9	ST	1715＋	LQFP176	20-10-09	询价
AMS1117-5.0(AMS1117/5.0)	880	AMS	1029	SOT223	20-10-09	询价
LM2596T-5.0	44	NS	KM24ADE3	TO-220	20-10-09	询价
TOP225YN	40	POWER	1126	TO-220	20-10-09	询价
MAC97A8	2000	NXP	1145	TO-92	20-10-09	询价
D882（D882）	1620	GB	1748＋	TO-252	20-10-09	询价
B772(B772)	1620	--	1747＋	SOT-89-3L	20-10-09	询价
KIA78L05F(78L05)	1556	KIA	1112	SOT-89	20-10-09	询价
TL072CDT(072C)	679	ST	GZ204	SOP8	20-10-09	询价
74HCT244D	710	NXP	1216/1215	SOP20 7.2MM	20-10-09	询价
LM393DT	1000	ST	07+	SOP8 3.9MM	20-10-09	询价
2SJ56	10	HITACHIP	--	TO-3	20-10-09	询价
SN75C1167NSR(75C1167)	117	TI	13A690K/87A9JLK/7CD4L7K	SOP16	20-10-09	询价
SD5001N	44	SILICON	T9318	DIP14	20-10-09	询价
FS8205,SOT23-6	1860	FJ	2011/3/13	SOT23-6	20-10-09	询价
UPC4558G2-T1	1770	NEC	342	SOP8	20-10-09	询价
7B-8.000MAAJ-T(8.00)	100	TXC	20180201	5032	20-10-09	询价
TLC2272IDR(2272I)	147	TI	CJ8H	SOP8	20-10-09	询价
3296W-1-105LF(1MΩ)	200	BOURNS	1727/1730(170626/170717)	DIP	20-10-09	询价
74HC14D,653(74HC14D)	1400	NAP	1720(170509)	SOP-14	20-10-09	询价
24LC01B-I/P(24LC01B/I/P)	413	MICR0CHIP	1713＋	DIP-8	20-10-09	询价
STM811TW16F(8AN)	480	ST	1721/PH	SOT23	20-10-09	询价
TL432AIDBZR(T4AU)	650	TI	1801(180103)	SOT23	20-10-09	询价
SN74AHC14PWR(HA14)	1000	TI	1110+5	TSSOP14	20-10-09	询价
CD4051BM96(CD4051BM)	500	TI	23P338AG3	SOP-16	20-10-09	询价
MSP430G2553IPW28R(430G2553)	70	TI	D5TK A	TSSOP28	20-10-09	询价
74HC4051PW(HC4051)	970	NXP	TnD1632F(160802)	TSSOP16	20-10-09	询价
ADG633YRUZ(ADG/633/YRUZ)	49	ADI	ADG/633/YRUZ	SSOP-16	20-10-09	询价
24LC08B-I/P	500	MICROCHIP	1041	DIP-8	20-10-09	询价

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